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Delivery standard
Material | Kingboard/GDM | Kingboard /SYtech |
Mechanical drilling |
PTH Hole Diameter Tolerance ±0.075mm NPTH Hole Diameter Tolerance +/-0.05mm Hole wall roughness≤25μm |
PTH Hole Diameter Tolerance ±0.075mm NPTH Hole Diameter Tolerance +/-0.05mm Hole wall roughness≤20μm |
Circuit |
Circuit complementing available, alignment accuracy +/ -4mil |
Circuit complementing not available, alignment accuracy +/ -3mil |
Plating |
Average hole copper 20UM copper plating ductility ≥15% |
Average hole copper 25UM copper plating ductility ≥20% |
Solder mask |
Drift rate +/-3.0mi The thickness of the ink 8um (Guangxin ink) |
Drift rate +/-2.0mi The thickness of the ink 10-15um (Guangxin & Taiyo) |
Accuracy to shape tolerance | ±0.13mm | ± 0.10mm (±0.05mm laser cutting can be specified) |
Surface finished copper thickness | 1OZ≥32UM,2OZ≥63UM,3OZ≥98UM | 1oz≥35μm,2oz≥70μm,3oz≥105μm |
Fire rating |
UL safety:94V0 (After two 10-second burn tests on the sample, the flame goes out in 10 seconds) |
UL safety:94V0 (After two 10-second burn tests on the sample, the flame goes out in 10 seconds) |
Continuity | Custom test rack test /100% flying probe full test |
Custom test rack test /100% flying probe full test / Four-wire low resistance test (Class III acceptance standard may include this, but it is not required to include this) |
Warpage | ≤0.75% | ≤0.5% |
Package | Normal packing/vacuum packing + desiccant | Vacuum packing + desiccant + humidity card + paper separation |
Delivery report | Delivery report |
Provide shipment report, test report, impedance report, with impedance strip according to product design and characteristics |
Physical experiment |
Solderability of soldering tin y: wetting area is greater than 95%, plating through hole is completely wet Thermal shock reliability: 288+/-5° 3 times/10s |
Solderability of soldering tin y: wetting area is greater than 95%, plating through hole is completely wet Thermal shock reliability: 288+/-5° 3 times/10s |
Acceptance standard | IPC-A-600J II | IPC-A-600J III |