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Delivery standard

Material Kingboard/GDM Kingboard /SYtech
Mechanical drilling

PTH Hole Diameter Tolerance ±0.075mm

NPTH Hole Diameter Tolerance +/-0.05mm

Hole wall roughness≤25μm

PTH Hole Diameter Tolerance ±0.075mm

NPTH Hole Diameter Tolerance +/-0.05mm

Hole wall roughness≤20μm

Circuit

Circuit complementing available,

alignment accuracy +/ -4mil

Circuit complementing not available,

alignment accuracy +/ -3mil

Plating

The average hole copper 18-20um

the ductility of copper plating ≥15%

The average hole copper 20-25um

the ductility of copper plating≥20%

Solder mask

Drift rate +/-3.0mi

The thickness of the ink 8um (Guangxin ink)

Drift rate +/-2.0mi

The thickness of the ink 10-15um (Guangxin & Taiyo)

Accuracy to shape tolerance ±0.13mm ±0.10mm
Surface finished copper thickness 1oz≥35μm,2oz≥63μm,3oz≥98μm 1oz≥35μm,2oz≥70μm,3oz≥105μm
Fire rating

UL safety:94V0

(After two 10-second burn tests on the sample, the flame goes out in 10 seconds)

UL safety:94V0

(After two 10-second burn tests on the sample, the flame goes out in 10 seconds)

Continuity Custom test rack test /100% flying probe full test

Custom test rack test /100% flying probe full test / Four-wire low resistance test (Class III acceptance standard may include this, but it is not required to include this)

Warpage ≤0.75% ≤0.5%
Package Normal packing/vacuum packing + desiccant Vacuum packing + desiccant + humidity card + paper separation
Delivery report Delivery report

Provide shipment report, test report, impedance report, with impedance strip according to product design and characteristics

Physical experiment

Solderability of soldering tin y: wetting area is greater than 95%,

plating through hole is completely wet

Thermal shock reliability:

288+/-5° 3 times/10s

Solderability of soldering tin y: wetting area is greater than 95%,

plating through hole is completely wet

Thermal shock reliability:

288+/-5° 3 times/10s

Acceptance standard IPC-A-600J II IPC-A-600J III