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PCBBUY – Global Electronic Hardware Manufacturer, committed to helping global users solve the problems of precise boards,
high boards, special boards, slow delivery of medium and small batch orders and difficulty of procurement.
8 Layers Board
10 Layers Board
12 Layers Board
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High quality & short lead time customized service for global customer over 100000+ choose us
4 Layers Board
Material: FR-4
Application: P2 sidplay screen
Layer/board thickness: 4/1.6mm
Surface finish: OSP
Trace width/spacing: 3.00/3.00mil
Mininum hole size: 0.2mm
Technolugy: Tending via, high-precision
4 Layers Board
Material: FR-4
Application: Module boards set
Layer/board thickness: 4/2.0mm
Surface finish: ENIG
Trace width/spacing: 8.00/8.00mil
Mininum hole size: 0.4mm
Technolugy: Multistage impedance control
of inner & outer layer
6 Layers Board
Material: FR-4
Application: industrial control
Layer/board thickness: 6/2.0mm
Surface finish: HASL
Trace width/spacing: 3.00/3.00mil
Mininum hole size: 0.25mm
Technolugy: vias not covered/copper thickness
6 Layers Board
Material: FR-4
Application: industrial electronics
Layer/board thickness: 6/1.6mm
Surface finish: ENIG
Trace width/spacing: 3.00/3.00mil
Mininum hole size: 0.3mm
Technolugy: high-precision/ENIG
8 Layers Board
Material: FR-4
Application: CE
Layer/board thickness: 8/1.6mm
Surface finish: HASL
Trace width/spacing: 4.00/4mil
Mininum hole size: 0.2mm
Technolugy: vias not covered/copper thickness
8 Layers Board
Material: FR-4
Application: intelligent printer
Layer/board thickness: 8/2.0mm
Surface finish: HASL
Trace width/spacing: 3.00/3.00mil
Mininum hole size: 0.2mm
Technology: multistage impedance matching, \
high precision
10 Layers Board
Material: FR-4
Application: industry control
Layer/board thickness: 10/2.0mm
Surface finish: ENEPIG
Trace width/spacing: 3.00/3mil
Mininum hole size: 0.2mm
Technolugy: ENEPIG
12 Layers Board
Material: FR-4
Application: power system
Layer/board thickness: 12/2.0mm
Surface finish: ENIG
Trace width/spacing: 3.00/3.00mil
Mininum hole size: 0.2mm
Technology: high TG, thick copper
PCB maximum size 625×500mm
Minimum trace width/space of inner and outer layer 3mil
Technology: Buried Vias hole, edge plating, two-tone ink, PTH, counterbore
Impedance matching of inner & outer layerranges: 45-110Ω
PCB boards thickness 0.25-3.0mm
Minimum hole size 0.2mm , aspect ratio of board thickness and hole size 20:1
Solder mask: tenting vias/vias not covered/plugged vias/ Epoxy filled vias
Support single/double PP specific stackup
Quality Certification
SGS is the world's leading testing,
inspection and certification company.
Core Technology
We have world-class PCB production equipment and high-precision testing equipment,
insist to produce high-quality products in essence
PTH & Plating
PTH & Plating
Gantry type vertical immersion line
Deep hole capacity reaches 13:1
Uniformity of copper plating more than 97% Pattern plating 70min
Hole wall copper thickness 18-22μm
Surface copper thickness ≥35um
Circuit
Circuit
LDI layer exposure,circuit exposure is more accurate
DSE integration production
Effective control line too thin, micro-short, incomplete etching
Minimum trace width & spacing 2mil
AOI to avoid hidden quality issues
Solder Mask
Solder Mask
Automatic solder mask
80 min baking in a multi-temperature zone
Make sure the uniformity and adhesion of solder mask
Solve yellowing and exposed copper of annular ring
Solder mask ink meets international safety standards
Test
Test
High-speed flying probe testers
Maximum test speed 3000 points/min
Positioning resolution
HD CCD probe positioning accurately
Avoid open circuits, short circuits