Phone:+86 18806715434

Service Time:China:9:00 - 18:00

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Our Service

PCBBUY specializes in 1-22 layer PCB prototyping and medium to large-scale production.

We focused on solving slow delivery and procurement difficulties for complex, high-difficulty, special, and multilayer-count orders.

8 Layers Board

  • Size≤10*10cm
  • Board thickness 1.2-2.4mm, copper
  • thickness1-3oz, minimum hole size 0.2mm,
  • minimum trace width 3mil.
  • AOI
  • 100% flying probe test
  • Epoxy filled vias
  • Copper clad on hole

10 Layers Board

  • Size≤10*10cm
  • Board thickness 1.6-2.4mm, copper
  • thickness1-10oz, minimum hole size 0.15mm,
  • minimum trace width 3mil.
  • Pattern plating 70min
  • Buried via
  • HF
  • Transparent solder mask

12 Layers Board

  • Size≤10*10cm
  • Board thickness1.6-2.4mm, copper
  • thickness1-10oz, minimum hole size 0.15mm,
  • minimum trace width 3mil.
  • Buried via、Multistage impedance
  • Custom stackup、Support TG130/180
  • Multistage Impedance Control
  • Specific Stackup

Product Display

High quality & short lead time customized service for global customer over 100000+ choose us

  • 4 Layers Board

    Material: FR-4

    Application: P2 sidplay screen

    Layer/board thickness: 4/1.6mm

    Surface finish: OSP

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technolugy: Tending via, high-precision

  • 4 Layers Board

    Material: FR-4

    Application: Module boards set

    Layer/board thickness: 4/2.0mm

    Surface finish: ENIG

    Trace width/spacing: 8.00/8.00mil

    Mininum hole size: 0.4mm

    Technolugy: Multistage impedance control

    of inner & outer layer

  • 6 Layers Board

    Material: FR-4

    Application: industrial control

    Layer/board thickness: 6/2.0mm

    Surface finish: HASL

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.25mm

    Technolugy: vias not covered/copper thickness

  • 6 Layers Board

    Material: FR-4

    Application: industrial electronics

    Layer/board thickness: 6/1.6mm

    Surface finish: ENIG

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.3mm

    Technolugy: high-precision/ENIG

  • 8 Layers Board

    Material: FR-4

    Application: CE

    Layer/board thickness: 8/1.6mm

    Surface finish: HASL

    Trace width/spacing: 4.00/4mil

    Mininum hole size: 0.2mm

    Technolugy: vias not covered/copper thickness

  • 8 Layers Board

    Material: FR-4

    Application: intelligent printer

    Layer/board thickness: 8/2.0mm

    Surface finish: HASL

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technology: multistage impedance matching, \

    high precision

  • 10 Layers Board

    Material: FR-4

    Application: industry control

    Layer/board thickness: 10/2.0mm

    Surface finish: ENEPIG

    Trace width/spacing: 3.00/3mil

    Mininum hole size: 0.2mm

    Technolugy: ENEPIG

  • 12 Layers Board

    Material: FR-4

    Application: power system

    Layer/board thickness: 12/2.0mm

    Surface finish: ENIG

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technology: high TG, thick copper

Multi-layer Technology Capability
  • PCB maximum size 625×500mm

  • Minimum trace width/space of inner and outer layer 3mil

  • Technology: Buried Vias hole, edge plating, two-tone ink, PTH, counterbore

  • Impedance matching of inner & outer layerranges: 45-110Ω

  • PCB boards thickness 0.25-3.0mm

  • Minimum hole size 0.2mm , aspect ratio of board thickness and hole size 20:1

  • Solder mask: tenting vias/vias not covered/plugged vias/ Epoxy filled vias

  • Support single/double PP specific stackup

Multi-layer Laminated Structure

PCBBUY support several specific stackup to meet your customized requirments.

Quality Certification

SGS is the world's leading testing,
inspection and certification company.

Core Technology

We have world-class PCB production equipment and high-precision testing equipment,

insist to produce high-quality products in essence

PTH & Plating

PTH & Plating

Gantry type vertical immersion line

Deep hole capacity reaches 13:1

Uniformity of copper plating more than 97% Pattern plating 70min

Hole wall copper thickness 18-22μm

Surface copper thickness ≥35um

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Circuit

Circuit

LDI layer exposure,circuit exposure is more accurate

DSE integration production

Effective control line too thin, micro-short, incomplete etching

Minimum trace width & spacing 2mil

AOI to avoid hidden quality issues

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Solder Mask

Solder Mask

Automatic solder mask

80 min baking in a multi-temperature zone

Make sure the uniformity and adhesion of solder mask

Solve yellowing and exposed copper of annular ring

Solder mask ink meets international safety standards

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Test

Test

High-speed flying probe testers

Maximum test speed 3000 points/min

Positioning resolution

HD CCD probe positioning accurately

Avoid open circuits, short circuits

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