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PCBBUY – Global Electronic Hardware Manufacturer, committed to helping global users solve the problems of precise boards,

high boards, special boards, slow delivery of medium and small batch orders and difficulty of procurement.

8 Layers Board

  • Size≤10*10cm
  • Board thickness 1.2-2.4mm, copper
  • thickness1-3oz, minimum hole size 0.2mm,
  • minimum trace width 3mil.
  • AOI
  • 100% flying probe test
  • Epoxy filled vias
  • Copper clad on hole

10 Layers Board

  • Size≤10*10cm
  • Board thickness 1.6-2.4mm, copper
  • thickness1-10oz, minimum hole size 0.15mm,
  • minimum trace width 3mil.
  • Pattern plating 70min
  • Buried via
  • HF
  • Transparent solder mask

12 Layers Board

  • Size≤10*10cm
  • Board thickness1.6-2.4mm, copper
  • thickness1-10oz, minimum hole size 0.15mm,
  • minimum trace width 3mil.
  • Buried via、Multistage impedance
  • Custom stackup、Support TG130/180
  • Multistage Impedance Control
  • Specific Stackup

Product Display

High quality & short lead time customized service for global customer over 100000+ choose us

  • 4 Layers Board

    Material: FR-4

    Application: P2 sidplay screen

    Layer/board thickness: 4/1.6mm

    Surface finish: OSP

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technolugy: Tending via, high-precision

  • 4 Layers Board

    Material: FR-4

    Application: Module boards set

    Layer/board thickness: 4/2.0mm

    Surface finish: ENIG

    Trace width/spacing: 8.00/8.00mil

    Mininum hole size: 0.4mm

    Technolugy: Multistage impedance control

    of inner & outer layer

  • 6 Layers Board

    Material: FR-4

    Application: industrial control

    Layer/board thickness: 6/2.0mm

    Surface finish: HASL

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.25mm

    Technolugy: vias not covered/copper thickness

  • 6 Layers Board

    Material: FR-4

    Application: industrial electronics

    Layer/board thickness: 6/1.6mm

    Surface finish: ENIG

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.3mm

    Technolugy: high-precision/ENIG

  • 8 Layers Board

    Material: FR-4

    Application: CE

    Layer/board thickness: 8/1.6mm

    Surface finish: HASL

    Trace width/spacing: 4.00/4mil

    Mininum hole size: 0.2mm

    Technolugy: vias not covered/copper thickness

  • 8 Layers Board

    Material: FR-4

    Application: intelligent printer

    Layer/board thickness: 8/2.0mm

    Surface finish: HASL

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technology: multistage impedance matching, \

    high precision

  • 10 Layers Board

    Material: FR-4

    Application: industry control

    Layer/board thickness: 10/2.0mm

    Surface finish: ENEPIG

    Trace width/spacing: 3.00/3mil

    Mininum hole size: 0.2mm

    Technolugy: ENEPIG

  • 12 Layers Board

    Material: FR-4

    Application: power system

    Layer/board thickness: 12/2.0mm

    Surface finish: ENIG

    Trace width/spacing: 3.00/3.00mil

    Mininum hole size: 0.2mm

    Technology: high TG, thick copper

Multi-layer Technology Capability
  • PCB maximum size 625×500mm

  • Minimum trace width/space of inner and outer layer 3mil

  • Technology: Buried Vias hole, edge plating, two-tone ink, PTH, counterbore

  • Impedance matching of inner & outer layerranges: 45-110Ω

  • PCB boards thickness 0.25-3.0mm

  • Minimum hole size 0.2mm , aspect ratio of board thickness and hole size 20:1

  • Solder mask: tenting vias/vias not covered/plugged vias/ Epoxy filled vias

  • Support single/double PP specific stackup

Multi-layer Laminated Structure

PCBBUY support several specific stackup to meet your customized requirments.

Quality Certification

SGS is the world's leading testing,
inspection and certification company.

Core Technology

We have world-class PCB production equipment and high-precision testing equipment,

insist to produce high-quality products in essence

PTH & Plating

PTH & Plating

Gantry type vertical immersion line

Deep hole capacity reaches 13:1

Uniformity of copper plating more than 97% Pattern plating 70min

Hole wall copper thickness 18-22μm

Surface copper thickness ≥35um

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Circuit

Circuit

LDI layer exposure,circuit exposure is more accurate

DSE integration production

Effective control line too thin, micro-short, incomplete etching

Minimum trace width & spacing 2mil

AOI to avoid hidden quality issues

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Solder Mask

Solder Mask

Automatic solder mask

80 min baking in a multi-temperature zone

Make sure the uniformity and adhesion of solder mask

Solve yellowing and exposed copper of annular ring

Solder mask ink meets international safety standards

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Test

Test

High-speed flying probe testers

Maximum test speed 3000 points/min

Positioning resolution

HD CCD probe positioning accurately

Avoid open circuits, short circuits

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