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Common Process Capability

Number Type Content Process Capability Remarks
1 Process capability Layer 1-12 layers

Refers to the number of electrical layers in PCB

(number of copper layers). At present, PCBbuy only

accepts 1-8 layers of through-hole board

(blind buried hole board)

2 Lamination Stackup 4/6/8 layers Check for stackup
3 Type of material Material FR-4 KB-6160(TG135)
KB-6165F(TG150)
KB-6167F(TG170)
FR-4(Halogen-free) KB HF-140
CEM-1 KB-5150(TG130)
FR-4(black core) GF113 BK A class
ROHS text report of black core
REACH text report of black core
4 Type of material Ink Guangxin Halogen-free soldering ink
solder soldering ink
Taiyo Flush coating of text
5 Process capability Panel size(Max) 1000×500mm

Single and double-sided PCB: single sided and panel 1000*500

mm(V-CUT width of guide rail direction not exceed 500mm)

Multi layer PCB: single sided board 625*500mm panel 625*480

mm (V-CUT width of guide rail direction not exceed 480mm)

6 Process capability Panel size(Min) 1×3mm

Single sided board Minimum production size >1×3mm ≤20×20 mm is super small board V-CUT panel Minimum production size>76×76mm Single sided board Minimum production size >1×3mm ≤20×20 mm is super small board V-CUT panel Minimum production size>76×76mm Remarks: osp≥50*80mm non-V-CUT directions>60mm Immersion Tin≥80*120MM

7 Process capability Board Thickness(Max) 0.25mm Board Thickness:0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4mm
8 Process capability Board Thickness(Min) 0.20mm
9 Process capability Thin Core Thickness(Min) 0.20mm The thickness of copper
10 Process capability Finished Board Thickness Tolerance(Board Thickness≥0.8mm) ±10%

If the thickness of board is T=1.6mm. the thickness of finished Board is 1.44mm(T-1.6×10%)~1.76mm(T+1.6×10%)

11 Process capability Finished Board Thickness Tolerance (0.4mm≤Board Thickness<0.8mm) ±0.10mm

If the thickness of board is T=0.6mm. the thickness of finished Board is 0.5mm(T-0.1)~0.7mm(T+0.1)

12 Process capability Warpage(Min) 0.75% Diagonal length *0.75%
13 Drilling Drill Size(Max) Φ6.5mm More than 6.5mm Can Reaming
14 Drilling Drill Size(Min) Φ0.20mm 0.20mm is the minimum hole size of drilling
15 Base Copper Thickness of Outer Layer(Min)

Single sided and double sided: Hoz/Multilayer 1/3oz

The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do Single sided and double sided Hoz/ Multilayer 1/3oz

16 Process capability Base Copper Thickness of Outer Layer(Max) 4oz The maximum thickness of copper foil for outer circuit, The maximum of PCBbuy can do 4oz
17 Process capability Base Copper Thickness of inner Layer(Min) 1/3oz The minimum thickness of copper foil for inter circuit, The minimum of PCBbuy can do 1/3oz
18 Process capability Base Copper Thickness of inner Layer(Max) 3oz The maximum thickness of copper foil for inter circuit, The minimum of PCBbuy can do 3oz
19 Thickness of insulation layer (min) 0.07mm The thickness of PP after lamination is 0.07mm
20 Surface finish Aspect Ratio(Max) 10:1
21 Drilling Hole Diameter Tolerance(PTH) ±0.075mm TH via: Tolerance of drilling is ±0.075mm, for example the design of hole is 0.6mm the hole size of finished board varies from 0.525mm-0.675mm is acceptable
22 Drilling Hole Diameter Tolerance(NPTH) ±0.05mm NPTH via: Tolerance of drilling is ±0.05mm, for example the design of hole is 0.6mm the hole size of finished board varies from 0.55mm-0.65mm is acceptable
23 Drilling Hole Position Tolerance(Compared with CAD Data) ±0.05mm
24 Process capability Holewall Copper Thickness(Full Hole) ≥18um Common average Customer may assign otherwise
25 Trace width/space Trace Width/Spacing of Outer Layer(Min)

T/Toz: 2.5mil/2.5mil(T=1/3oz)

H/Hoz: 2.5mil/2.5mil

1/1oz: 3mil/3mil

2/2oz: 6mil/6mil

3/3oz: 10mil/10mil

4/4oz:14 mil/14mil

Parameter is Default of PCBBUY
26 Trace width/space Trace Width/Spacing of Inner Layer(Min)

T/T oz: 2.5mil/ 2.5mil(T=1/3oz)

H/H oz: 2.5mil/2.5mil

1/1 oz: 4mil/4mil

2/2 oz: 5mil/5mil

3/3 oz: 8mil/8mil

4/4OZ: 14 mil/14 mil

Parameter is Default of PCBBUY
27 Trace width/space Etching Tolerance ±15% If the trace width is T=4mil, then the real trace width is 3.4mil(T-4mil×15%)~4.6mil(T+4mil×15%)
28 Pattern transfer Outer Image to Hole Tolerance(Min) ±3mil Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified
29 Pattern transfer Hole to Hole Tolerance(Min) ±2mil Circuit Image to Hole Tolerance(Min) Physical difference of ±2mil is qualified
30 Solder mask Solder Mask Registration Tolerance ±3mil Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified
31 Solder mask Solder Mask Thickness(Min) ≥8μm Solder mask with Guangxin Ink ≥8μm
32 Solder mask Solder bridge(minimum)

Green oil:4mil

Black/white、pink:5mil

Other variegated oils:4mil

If there are welding resistance bridge requirements, please note! If the color of the resistance is green, the width of the ink must be ≥4mil(wire bonding pad with The cooper thickness of 1oz, The spacing needs to be 7mil)black/white/pink: the width of the ink must be ≥5mil (wire bonding pad with Thecooper thickness of 1oz, The spacing needs to be 7mil) other variegated oils: the width of the ink must be ≥4mil
33 Solder mask Solder Mask Plugged Hole Diameter ≤0.45mm Solder Mask Plugged Hole size ≤0.45mm when the hole in board ≥0.45mm Default oil plugging will not be full
34 Surface plating thickness Minimum Nickel Thickness of ENIG
35 Surface plating thickness Minimum Gold Thickness of ENIG(Max) 1-3uin(μ") Special requirements can be specified
36 Surface plating thickness Solder Thickness on XFP (HAL) 2-40μm
37 Appearance Routing Dimension Tolerance ±4mil
38 Appearance Routing Dimension Tolerance(Hole to Edge) ±4mil
39 Appearance Radius by Routing (Internal Angle)(Min) R≥0.5mm
40 Appearance Countersink Hole Size Due to the requirements of customers
41 Appearance V-V-CUT Remaining Thickness Tolerance(MIN) ±0.10mm The minimum of V-CUT Remaining Thickness ±0.10mm
42 Appearance V-CUT MISREGISTRATION (MIN) 0.10mm The minimum of V-CUT MISREGISTRATION 0.10mm
43 Appearance V-CUT boards thickness(min/max) 0.5mm/3.2mm Currently support V-CUT thickness 0.5mm to 3.2mm (2.4≤ board thickness ≤0.4mm recommended stamp hole, if specified V-CUT does not meet the tolerance of ±0.10mm by default)
44 Process capability Impedance Tolerance(Min) ±10% If Impedance is T=50Ω then the real Impedance 45Ω(T-50Ω×10%)~55Ω(T+50Ω×10%)
45 Process capability Pitch-row / the processing range from hole to trace ±10%

0.2mm,via hole to line

0.3mm , component hole to line

46 Process capability High-end option process

V-cut length is not limited

Four-wire measurement

two - color welding resistance,

two - color text

V-cut nearest two tools distance ≥2mm

The minimum pad of measurement ≥4*8mil

(High-end surcharge is in effect)

Two color soldering resistance seamless butt tolerance+/-1mm

47 Process capability Hole spacing/hole-to-trace range

V-cut length is not limited

Four-wire measurement

two - color welding resistance,

two - color text

VIA through hole to hole 0.25mm

PTH component hole spacing 0.5mm

VIA through hole to trace 0.2mm

PTH component hole to trace 0.3mm

Plugged Via Production Capacity of Panel

Number Item Standard Remarks
1 Production size 210-610*760mm Overspecification requires technical reassessment
2 Board thickness 0.2-8.0mm Overspecification requires technical reassessment
3 Hole size of plugged via Drilling 0.15-0.8mm Max hole size of plugged via Overspecification requires technical reassessment
4 Ink Zhuyou epoxy ink

ROHS text report of epoxy ink

UL text report of epoxy ink

Technical data of epoxy ink

5 Surface copper thickness Supplied surface copper ≥15μmPlating filling hole and grinding surface copper≥30μm Substrates below 15μm are extremely risky
6 Aspect ratio(board thickness to hole size) Through hole 40:1 blind via 1:1 Overspecification requires technical reassessment
7 Leave a margin of board Distance of board edge and Fortress hole ≥15mm Either side of board≥15mm is ok
8 Hole size The size range of adjacent holes is within 0.3mm Overspecification requires technical reassessment
9 Reduce copper amount when the board is flat reduce the amount of copper 3-5μm If over 8μm, copper should be reduced separately

Optional Plugged Via Production Capacity

Number Item Standard Remarks
1 Production size 210-610*760mm Overspecification requires technical reassessment
2 Board thickness 0.2-8.0mm Overspecification requires technical reassessment
3 Hole size of plugged via ≥0.15mm Overspecification requires technical reassessment
4 Ink Zhuyou epoxy ink

ROHS text report of epoxy ink

UL text report of epoxy ink

Technical data of epoxy ink

5 Surface copper thickness Supplied surface copper ≥15μm Ubstrates below 15μm are extremely
6 Aspect ratio(board thickness to hole size) Through hole 30:1 blind via 1:1 Overspecification requires technical reassessment
7 Leave a margin of board Space of fortress hole and non fortress hole>0.4mm Overspecification requires technical reassessment
8 Hole size Single PNL hole size range within 0.3mm Overspecification requires technical reassessment
9 Reduce copper amount when the board is flat reduce the amount of copper 3-5μm If over 8μm, copper should be reduced separately

Processing Quality (If the customer does not specify any special requirements, our company will produce according to the following control indicators)

Number Item Standard Remarks
1 Sunken hole

Hole size≤0.4mm,Sag ≤5μm Hole size≤0.4mm,

Sag ≤15μm Hole size / Sink

If over 8μm, copper should be reduced separately
2 Over plugged/ missing plugged None None
3 Incomplete grinding Remain epoxy of hole edge≤20μm Remain epoxy of hole edge≤50μm
4 Surface copper after grinding RZ≤0.5μm Rt≤1.0μm Ubstrates below 15μm are extremely
5 Expand and contract after grinding

board thickness≥0.4mm expansion and

contraction≤0.03%

board thickness<0.4mm decide through

consultation Board thickness≥0.4mm Expand and

contract≤0.03% come to an agreement

board thickness≥0.4mm expansion and

contraction≤0.03%

board thickness<0.4mm decide through consultation

Note:

1. Grinding requirements: it is necessary to ensure that the board is pressed flat as the premise and the surface cannot be uneven.

2.Special material (ceramic board, PTFE material will not be processed) should be specially marked on the delivery note. If the special material is not marked, it will be produced as normal (FR4).

3.The default TG value of resin in our company is 150, which matches the TG value of processed copper-clad plate 150±5. If any processed plate exceeds the range, please inform us separately.

Our company will not assume any responsibility for the subsequent process scrap caused by this problem.

4.Before the customer sends the plug via, it must go through the pre-treatment. The surface of the board and the hole cannot remain the liquid medicine or plug the vias, otherwise it will cause

the bad plug hole.

5.If the customer's incoming material exceeds our production capacity and insists on continuing production after communication, our company will not assume any responsibility for the scrap generated.