Phone：+86 18806715434
Service Time：China:9:00 - 18:00
China Time Zone(GMT+8)(Update in 5 mins)
Phone：+86 18806715434
Service Time：China:9:00 - 18:00
China Time Zone(GMT+8)(Update in 5 mins)
Common Process Capability
| Number | Type | Content | Process Capability | Remarks |
| 1 | Process capability | Layer | 1-22 layers |
Refers to the number of electrical layers in PCB (number of copper layers). At present, PCBbuy only accepts 1-22 layers of through-hole board (blind buried hole board) |
| 2 | Process capability | Stackup | 4,6,8,10,12 layers | Check for stackup |
| 3 | Type of material | Material | FR-4 |
KB-6160(TG135) KB-6165F(TG150) KB-6167F(TG170) |
| FR-4(Halogen-free) | KB HF-140 | |||
| CEM-1 | KB-5150(TG130) | |||
| FR-4(black core) |
GF113 BK A class ROHS text report of black core REACH text report of black core |
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| 4 | Type of material | Ink | Guangxin |
Halogen-free soldering ink solder soldering ink |
| Taiyo | Flush coating of text | |||
| 5 | Process capability | Panel size(Max) | 1000×600mm |
1-2: 1 piece and panel 1000*600mm (VCUT direction shall not exceed 600mm) 4 layers: 1 piece 1000*500mm, assembling plate 1000*480mm (VCUT direction shall not exceed 480mm) 6 layers: 1 piece 900*500mm, panel 900*480mm (VCUT direction shall not exceed 480mm) 8 layers: 1 piece 625*500mm, panel 625*480mm (VCUT direction shall not exceed 480mm) 10 layers / 12 layers: 1 piece 400*300mm, assembling 600*480mm (VCUT direction shall not exceed 480mm) |
| 6 | Process capability | Panel size(Min) | 1×3mm |
The minimum board size of 1 piece > 1×3mm, ≤20×20mm is super small board The minimum board size of the panel is > 60×60mm The minimum board size of V slot board is > 80×80mm Note: OSP≥50*80mm HASL ≥80*120MM |
| 7 | Process capability | Board Thickness(Max) | 3.0mm | Board Thickness：0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm |
| 8 | Process capability | Board Thickness(Min) | 0.25mm | |
| 9 | Process capability | Thin Core Thickness(Min) | 0.20mm | The thickness of copper(custom min copper thickness is 0.10mm) |
| 10 | Process capability | Finished Board Thickness Tolerance (0.3mm ≤ Board Thickness < 0.8mm) | ±10% |
If the thickness of board is T=1.6mm. the thickness of finished Board is 1.44mm（T－1.6×10%）～1.76mm（T＋1.6×10%） |
| 11 | Process capability | (0.3mm≤Board Thickness<0.8mm) | ±0.10mm |
If the thickness of board is T=0.6mm. the thickness of finished Board is 0.5mm（T-0.1）～0.7mm（T+0.1） |
| 12 | Process capability | Warpage(Min) | 0.75% | Diagonal length *0.75% (custom≤0.5%) |
| 13 | Drilling | Drill Size(Max) | Φ6.5mm | More than 6.5mm Can Reaming |
| 14 | Drilling | Drill Size(Min) | Φ0.15mm | 0.15mm is the minimum hole size of drilling(custom 0.15mm) |
| 15 | Drilling | Copper half hole soze (min) | Φ0.60mm | If the value is smaller than this value, evaluate the value based on actual data |
| 16 | Drilling | HDT hole size (min) | Φ0.10mm | If the value is smaller than this value, evaluate the value based on actual data |
| 17 | Base Copper Thickness of Outer Layer(Min) |
Single sided and double sided： Hoz/Multilayer 1/3oz |
The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do Single sided and double sided Hoz/ Multilayer 1/3oz |
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| 18 | Trace | Base Copper Thickness of Outer Layer(Min) | 1oz | The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do 1oz |
| 19 | Trace | Base Copper Thickness of Outer Layer(Max) | 4oz | The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤10oz) |
| 20 | Trace | Base Copper Thickness of inner Layer(Min) | Hoz | The minimum thickness of copper foil for inter circuit, The minimum of PCBbuy can do Hoz |
| 21 | Trace | Base Copper Thickness of inner Layer(Max) | 3oz | The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤ 4oz) |
| 22 | Process capability | Thickness of insulation layer (min) | 0.07mm | The thickness of PP after lamination is 0.07mm |
| 23 | Surface finish | Aspect Ratio | 10:1 | Could be customized≤20:1 |
| 24 | Drilling | Hole Diameter Tolerance(PTH) | ±0.075mm (Assignable ±0.05mm) | PTH: Tolerance of drilling is ±0.075mm, for example the design of hole is 0.6mm the aperture of finished board varies from 0.525mm-0.675mm is acceptable (VIA attributes of the hole is CLP hole, no tolerance control) |
| 25 | Drilling | Hole Diameter Tolerance(NPTH) | ±0.05mm | NPTH via: Tolerance of drilling is ±0.05mm, for example the design of hole is 0.6mm the hole size of finished board varies from 0.55mm-0.65mm is acceptable |
| 26 | Drilling | Hole Position Tolerance(Compared with CAD Data) | ±0.05mm | |
| 27 | Surface finish | Holewall Copper Thickness(Full Hole) | Conventional average ≥18um | Our company routinely upgrades to the average hole copper ≥18um to improve PCB conduction stability and anti-aging ability, but the customer can specify otherwise |
| 28 | Trace | Trace Width/Spacing of Outer Layer(Min) |
T/Toz: 2.5mil/2.5mil(T=1/3oz) H/Hoz: 2.5mil/2.5mil 1/1oz: 3mil/3mil 2/2oz: 6mil/6mil 3/3oz: 10mil/10mil 4/4oz:14 mil/14mil |
Parameter is Default of PCBBUY |
| 29 | Trace | Trace Width/Spacing of Inner Layer(Min) |
T/T oz: 2.5mil/ 2.5mil（T=1/3oz） H/H oz: 2.5mil/2.5mil 1/1 oz: 4mil/4mil 2/2 oz: 5mil/5mil 3/3 oz: 8mil/8mil 4/4OZ: 14 mil/14 mil |
Parameter is Default of PCBBUY |
| 30 | Trace | Etching Tolerance | ±20%(assign 10%) | 3.2mil（T－4mil×20%）～4.8mil（T＋4mil×20%） If the line width is T=4mil, then the real line width is 3.2mil（T－4mil×20%）～4.8mil（T＋4mil×20%） |
| 31 | Trace | Outer Image to Hole Tolerance(Min) | ±3mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified |
| 32 | Trace | Hole to Hole Tolerance(Min) | ±2mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±2mil is qualified |
| 33 | Solder mask | Solder Mask Registration Tolerance | ±3mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified |
| 34 | Solder mask | Solder Mask Thickness(Min) | ≥8μm | Solder mask with Guangxin Ink ≥8μm |
| 35 | Solder mask | Solder bridge(minimum) |
Green oil：4mil Black/white、pink：5mil Other variegated oils：4mil |
If there are welding resistance bridge requirements, please note! If the color of the resistance is green, the width of the ink must be ≥4mil(wire bonding pad with The cooper thickness of 1oz, The spacing needs to be 7mil)black/white/pink: the width of the ink must be ≥5mil (wire bonding pad with Thecooper thickness of 1oz, The spacing needs to be 7mil) other variegated oils: the width of the ink must be ≥4mil |
| 36 | Solder mask | Solder Mask Plugged Hole Diameter | ≤0.45mm | Solder Mask Plugged Hole size ≤0.45mm when the hole in board ≥0.45mm Default oil plugging will not be full |
| 37 | surface finish | ENIG | 100-200uin(μ") | Special requirements can be specified |
| 38 | surface finish | ENEPIG |
NI:200u" Pd:1-10u" Au:1-10u" |
Special requirements can be specified, The specified thickness of palladium and gold of ENEPIG shall not exceed 30U ", and the specified thickness of nickel shall not exceed 300U" |
| 39 | surface finish | Minimum Gold Thickness of ENIG(Max) | 1-3uin（μ"） | Special requirements can be specified |
| 40 | surface finish | Lead/Lead-free HASL | 2-40μm | |
| 41 | surface finish | Immersion Gold （Hard gold） |
NI:120-200u" AU 1-100 u" |
Alloy (gold palladium, gold nickel, gold cobalt, gold chromium, gold bismuth, etc.) if full board Immersion Gold, not standard order, gold thickness can be specified separately |
| 42 | surface finish | Selective electroplating + goldfingers | AU:3-100 u" | Selective leads - you need to select residue or non-residue when placing an order |
| 43 | Appearance | Routing Dimension Tolerance | ±5.2mil (0.13MM) | Limit of ±2 MIL (0.1mm); V-CUT board single unit outline dimension tolerance is ±9.8 MIL (0.25mm) |
| 44 | Appearance | Routing Dimension Tolerance(Hole to Edge) | ±7mil (0.177MM) | Limit ±6mil (0.15mm) |
| 45 | Appearance | Radius by Routing (Internal Angle)(Min) | R≥0.5mm | |
| 46 | Appearance | Countersink Hole Size | Due to the requirements of customers | Due to the requirements of customers |
| 47 | Appearance | V-V-CUT Remaining Thickness Tolerance(MIN) | 1/3 of the thickness of the finished board | Support for special requests |
| 48 | Appearance | V-CUT MISREGISTRATION （MIN） | 0.10mm | The minimum of V-CUT MISREGISTRATION 0.10mm |
| 49 | Appearance | V-CUT boards thickness（min/max） | 0.5mm/3.2mm | Currently support V-CUT thickness 0.5mm to 3.2mm (2.4≤ board thickness ≤0.4mm recommended stamp hole, if specified V-CUT does not meet the tolerance of ±0.10mm by default) |
| 50 | Process capability | Impedance Tolerance(Min) | ±10% | If Impedance is T=50Ω then the real Impedance 45Ω（T－50Ω×10%）～55Ω（T＋50Ω×10%） |
| 51 | Process capability | Pitch-row / the processing range from hole to trace | ±10% |
0.2mm，PCB via alignment 0.3mm , components alignment |
| 52 | Process capability | High-end option process |
V-cut length is not limited Four-wire measurement two-color welding resistance, two-color text |
V-cut nearest two tools distance ≥2mm The minimum pad of measurement ≥4*8mil (High-end surcharge is in effect) Two color soldering resistance seamless butt tolerance+/-1mm |
| 53 | Trace | Hole spacing/hole-to-trace range |
V-cut length is not limited Four-wire measurement two - color welding resistance, two - color text |
VIA through hole to hole 0.25mm PTH component hole spacing 0.5mm VIA through hole to trace 0.2mm PTH component hole to trace 0.3mm |
Plugged Via Production Capacity of Panel
| Number | Item | Standard | Remarks |
| 1 | Production size | 210-610*760mm | Overspecification requires technical reassessment |
| 2 | Board thickness | 0.2-8.0mm | Overspecification requires technical reassessment |
| 3 | Hole size of plugged via | Drilling 0.15-0.8mm Max hole size of plugged via | Overspecification requires technical reassessment |
| 4 | Ink | Zhuyou epoxy ink | |
| 5 | Surface copper thickness | Supplied surface copper ≥15μmPlating filling hole and grinding surface copper≥30μm | Substrates below 15μm are extremely risky |
| 6 | Aspect ratio(board thickness to hole size) | Through hole 40:1 blind via 1:1 | Overspecification requires technical reassessment |
| 7 | Leave a margin of board | Distance of board edge and Fortress hole ≥15mm | Either side of board≥15mm is ok |
| 8 | Hole size | The size range of adjacent holes is within 0.3mm | Overspecification requires technical reassessment |
| 9 | Reduce copper amount | when the board is flat reduce the amount of copper 3-5μm | If over 8μm, copper should be reduced separately |
Optional Plugged Via Production Capacity
| Number | Item | Standard | Remarks |
| 1 | Production size | 210-610*760mm | Overspecification requires technical reassessment |
| 2 | Board thickness | 0.2-8.0mm | Overspecification requires technical reassessment |
| 3 | Hole size of plugged via | ≥0.15mm | Overspecification requires technical reassessment |
| 4 | Ink | Zhuyou epoxy ink | |
| 5 | Surface copper thickness | Supplied surface copper ≥15μm | Ubstrates below 15μm are extremely |
| 6 | Aspect ratio(board thickness to hole size) | Through hole 30:1 blind via 1:1 | Overspecification requires technical reassessment |
| 7 | Leave a margin of board | Space of fortress hole and non fortress hole>0.4mm | Overspecification requires technical reassessment |
| 8 | Hole size | Single PNL hole size range within 0.3mm | Overspecification requires technical reassessment |
| 9 | Reduce copper amount | when the board is flat reduce the amount of copper 3-5μm | If over 8μm, copper should be reduced separately |
Processing Quality (If the customer does not specify any special requirements, our company will produce according to the following control indicators)
| Number | Item | Standard | Remarks |
| 1 | Sunken hole |
hole size ≤0.4mm, dent ≤15μm hole size > 0.4mm, dent ≤50μm Control of zero dent requires technical re-evaluation |
If over 8μm, copper should be reduced separately |
| 2 | Over plugged/ missing plugged | None | None |
| 3 | Incomplete grinding | Remain epoxy of hole edge≤20μm | Remain epoxy of hole edge≤50μm |
| 4 | Surface copper after grinding | RZ≤0.5μm Rt≤1.0μm | Ubstrates below 15μm are extremely |
| 5 | Expand and contract after grinding |
board thickness≥0.4mm expansion and contraction≤0.03% board thickness＜0.4mm decide through consultation Board thickness≥0.4mm Expand and contract≤0.03% come to an agreement |
board thickness≥0.4mm expansion and contraction≤0.03% board thickness＜0.4mm decide through consultation |
Note：
1. Grinding requirements: it is necessary to ensure that the board is pressed flat as the premise and the surface cannot be uneven.
2.Special material (ceramic board, PTFE material will not be processed) should be specially marked on the delivery note. If the special material is not marked, it will be produced as normal (FR4).
3.The default TG value of resin in our company is 150, which matches the TG value of processed copper-clad plate 150±5. If any processed plate exceeds the range, please inform us separately.
Our company will not assume any responsibility for the subsequent process scrap caused by this problem.
4.Before the customer sends the plug via, it must go through the pre-treatment. The surface of the board and the hole cannot remain the liquid medicine or plug the vias, otherwise it will cause
the bad plug hole.
5.If the customer's incoming material exceeds our production capacity and insists on continuing production after communication, our company will not assume any responsibility for the scrap generated.
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