Phone：+86 18806715434
Service Time：China:9:00 - 18:00
China Time Zone(GMT+8)(Update in 5 mins)
Phone：+86 18806715434
Service Time：China:9:00 - 18:00
China Time Zone(GMT+8)(Update in 5 mins)
Common Process Capability
| Number | Type | Content | Process Capability | Remarks |
| 1 | Process capability | Layer | 1-26 layers |
Refers to the number of electrical layers in PCB (number of copper layers). At present, PCBbuy only accepts 1-26 layers of through-hole board (blind buried hole board) |
| 2 | Process capability | Stackup | 4,6,8,10,12 layers | Check for stackup |
| 3 | Type of material | Material | FR-4(Kingboard) |
建滔KB6160(TG130) 建滔KB6164(TG140) 建滔KB6165F(TG150) 建滔KB6167F(TG170) |
| FR-4(Shengyi) |
生益S1000-2M 生益S1000H |
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| FR-4(Halogen-free) |
建滔KBHF140 生益SH260 |
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| FR-4(black core) | 国纪GF113系列 | |||
| CEM-1 | 建滔KB5150 | |||
| High-frequency board | Rogers3000-4000系列 | |||
| 4 | Type of material | Ink | Guangxin |
Halogen-free soldering ink solder soldering ink |
| San Qiu | SanQiu Ink | |||
| Taiyo | Flush coating of text | |||
| 5 | Process capability | Panel size(Max) | 1000×600mm |
1-2: 1 piece and panel 1000*600mm (VCUT direction shall not exceed 600mm) 4 layers: 1 piece 1000*500mm, assembling plate 1000*480mm (VCUT direction shall not exceed 480mm) 6 layers: 1 piece 900*500mm, panel 900*480mm (VCUT direction shall not exceed 480mm) 8 layers: 1 piece 625*500mm, panel 625*480mm (VCUT direction shall not exceed 480mm) 10 layers / 12 layers: 1 piece 400*300mm, assembling 600*480mm (VCUT direction shall not exceed 480mm) |
| 6 | Process capability | Panel size(Min) | 1×3mm |
The minimum board size of 1 piece > 1×3mm, ≤20×20mm is super small board The minimum board size of the panel is > 60×60mm The minimum board size of V slot board is > 80×80mm Note: OSP≥50*80mm HASL ≥80*120MM |
| 7 | Process capability | Board Thickness(Max) | 3.0mm | Board Thickness：0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm |
| 8 | Process capability | Board Thickness(Min) | 0.25mm | |
| 9 | Process capability | Thin Core Thickness(Min) | 0.20mm | The thickness of copper(custom min copper thickness is 0.10mm) |
| 10 | Process capability | Finished Board Thickness Tolerance (0.3mm ≤ Board Thickness < 0.8mm) | ±10% |
If the thickness of board is T=1.6mm. the thickness of finished Board is 1.44mm（T－1.6×10%）～1.76mm（T＋1.6×10%） |
| 11 | Process capability | (0.3mm≤Board Thickness<0.8mm) | ±0.10mm |
If the thickness of board is T=0.6mm. the thickness of finished Board is 0.5mm（T-0.1）～0.7mm（T+0.1） |
| 12 | Process capability | Warpage(Min) | 0.75% | Diagonal length *0.75% (custom≤0.5%) |
| 13 | Drilling | Drill Size(Max) | Φ6.5mm | More than 6.5mm Can Reaming |
| 14 | Drilling | Drill Size(Min) | Φ0.15mm | 0.15mm is the minimum hole size of drilling(custom 0.15mm) |
| 15 | Drilling | Copper half hole soze (min) | Φ0.60mm | If the value is smaller than this value, evaluate the value based on actual data |
| 16 | Drilling | HDT hole size (min) | Φ0.10mm | If the value is smaller than this value, evaluate the value based on actual data |
| 17 | Base Copper Thickness of Outer Layer(Min) |
Single sided and double sided： Hoz/Multilayer 1/3oz |
The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do Single sided and double sided Hoz/ Multilayer 1/3oz |
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| 18 | Trace | Base Copper Thickness of Outer Layer(Min) | 1oz | The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do 0.5oz |
| 19 | Trace | Base Copper Thickness of Outer Layer(Max) | 4oz | The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤10oz) |
| 20 | Trace | Base Copper Thickness of inner Layer(Min) | Hoz | The minimum thickness of copper foil for inter circuit, The minimum of PCBbuy can do 1/3oz |
| 21 | Trace | Base Copper Thickness of inner Layer(Max) | 3oz | The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤ 8oz) |
| 22 | Process capability | Thickness of insulation layer (min) | 0.07mm | The thickness of PP after lamination is 0.07mm |
| 23 | Surface finish | Aspect Ratio | 10:1 | Could be customized≤20:1 |
| 24 | Drilling | Hole Diameter Tolerance(PTH) | ±0.075mm (Assignable ±0.05mm) | PTH: Tolerance of drilling is ±0.075mm, for example the design of hole is 0.6mm the aperture of finished board varies from 0.525mm-0.675mm is acceptable (VIA attributes of the hole is CLP hole, no tolerance control) |
| 25 | Drilling | Hole Diameter Tolerance(NPTH) | ±0.05mm | NPTH via: Tolerance of drilling is ±0.05mm, for example the design of hole is 0.6mm the hole size of finished board varies from 0.55mm-0.65mm is acceptable |
| 26 | Drilling | Hole Position Tolerance(Compared with CAD Data) | ±0.05mm | |
| 27 | Surface finish | Holewall Copper Thickness(Full Hole) | Conventional average ≥18um | Our company routinely upgrades to the average hole copper ≥18um to improve PCB conduction stability and anti-aging ability, but the customer can specify otherwise |
| 28 | Trace | Trace Width/Spacing of Outer Layer(Min) |
T/T OZ： 2mil/ 2mil（T=1/3oz） H/Hoz： 2mil/2mil 1/1oz： 2mil/2mil 2/2oz： 5mil/5mil 3/3oz： 7mil/7mil 4/4oz：12 mil/12 mil |
Parameter is Default of PCBBUY |
| 29 | Trace | Trace Width/Spacing of Inner Layer(Min) |
T/T oz: 2.5mil/ 2.5mil（T=1/3oz） H/H oz: 2.5mil/2.5mil 1/1 oz: 4mil/4mil 2/2 oz: 5mil/5mil 3/3 oz: 8mil/8mil 4/4OZ: 14 mil/14 mil |
Parameter is Default of PCBBUY |
| 30 | Trace | Etching Tolerance | ±20%(assign 10%) | 3.2mil（T－4mil×20%）～4.8mil（T＋4mil×20%） If the line width is T=4mil, then the real line width is 3.2mil（T－4mil×20%）～4.8mil（T＋4mil×20%） |
| 31 | Trace | Outer Image to Hole Tolerance(Min) | ±3mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified |
| 32 | Trace | Hole to Hole Tolerance(Min) | ±2mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±2mil is qualified |
| 33 | Solder mask | Solder Mask Registration Tolerance | ±3mil | Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified |
| 34 | Solder mask | Solder Mask Thickness(Min) | ≥8μm | Solder mask with Guangxin Ink ≥8μm |
| 35 | Solder mask | Solder bridge(minimum) |
Green oil：4mil Black/white、pink：5mil Other variegated oils：4mil |
If there are welding resistance bridge requirements, please note! If the color of the resistance is green, the width of the ink must be ≥4mil(wire bonding pad with The cooper thickness of 1oz, The spacing needs to be 7mil)black/white/pink: the width of the ink must be ≥5mil (wire bonding pad with Thecooper thickness of 1oz, The spacing needs to be 7mil) other variegated oils: the width of the ink must be ≥4mil |
| 36 | Solder mask | Solder Mask Plugged Hole Diameter | ≤0.45mm | Solder Mask Plugged Hole size ≤0.45mm when the hole in board ≥0.45mm Default oil plugging will not be full |
| 37 | surface finish | ENIG | 100-200uin(μ") | Special requirements can be specified |
| 38 | surface finish | ENEPIG |
NI:200u" Pd:1-10u" Au:1-10u" |
Special requirements can be specified, The specified thickness of palladium and gold of ENEPIG shall not exceed 30U ", and the specified thickness of nickel shall not exceed 300U" |
| 39 | surface finish | Minimum Gold Thickness of ENIG(Max) | 1-3uin（μ"） | Special requirements can be specified |
| 40 | surface finish | Lead/Lead-free HASL | 2-40μm | |
| 41 | surface finish | Immersion Gold （Hard gold） |
NI:120-200u" AU 1-100 u" |
Alloy (gold palladium, gold nickel, gold cobalt, gold chromium, gold bismuth, etc.) if full board Immersion Gold, not standard order, gold thickness can be specified separately |
| 42 | surface finish | Selective electroplating + goldfingers | AU:3-100 u" | Selective leads - you need to select residue or non-residue when placing an order |
| 43 | Appearance | Routing Dimension Tolerance | ±5.2mil (0.13MM) | Limit of ±2 MIL (0.1mm); V-CUT board single unit outline dimension tolerance is ±9.8 MIL (0.25mm) |
| 44 | Appearance | Routing Dimension Tolerance(Hole to Edge) | ±7mil (0.177MM) | Limit ±6mil (0.15mm) |
| 45 | Appearance | Radius by Routing (Internal Angle)(Min) | R≥0.5mm | |
| 46 | Appearance | Countersink Hole Size | Due to the requirements of customers | Due to the requirements of customers |
| 47 | Appearance | V-V-CUT Remaining Thickness Tolerance(MIN) | 1/3 of the thickness of the finished board | Support for special requests |
| 48 | Appearance | V-CUT MISREGISTRATION （MIN） | 0.10mm | The minimum of V-CUT MISREGISTRATION 0.10mm |
| 49 | Appearance | V-CUT boards thickness（min/max） | 0.5mm/3.2mm | Currently support V-CUT thickness 0.5mm to 3.2mm (2.4≤ board thickness ≤0.4mm recommended stamp hole, if specified V-CUT does not meet the tolerance of ±0.10mm by default) |
| 50 | Process capability | Impedance Tolerance(Min) | ±10% | If Impedance is T=50Ω then the real Impedance 45Ω（T－50Ω×10%）～55Ω（T＋50Ω×10%） |
| 51 | Process capability | Pitch-row / the processing range from hole to trace | ±10% |
0.2mm，PCB via alignment 0.3mm , components alignment |
| 52 | Process capability | High-end option process |
V-cut length is not limited Four-wire measurement two-color welding resistance, two-color text |
V-cut nearest two tools distance ≥2mm The minimum pad of measurement ≥4*8mil (High-end surcharge is in effect) Two color soldering resistance seamless butt tolerance+/-1mm |
| 53 | Trace | Hole spacing/hole-to-trace range |
V-cut length is not limited Four-wire measurement two - color welding resistance, two - color text |
VIA through hole to hole 0.25mm PTH component hole spacing 0.5mm VIA through hole to trace 0.2mm PTH component hole to trace 0.3mm |
HDI
| Number | Item | Standard | Remarks |
| 1 | Material | FR-4 | TG135-TG170, halogen-free /CTI materials to be customized |
| 2 | Number of Layers |
1st order: 4-10 layers 2nd stage: 6-10 layers |
Could be customized |
| 3 | Construction Type |
1st order example: 1+N+1, 1+1+N+1 +1 (n buried vias ≤0.3mm) 2nd order example:2+N+2, 1+2+N+2+1 (n buried vias ≤0.3mm) |
Based on the customer’s document laminated structure, the internal mechanical via structure will be preferred, if limited, you can choose electroplating via filling process |
| 4 | Trace width | 2/2mil (min) | |
| 5 | Blind Via |
Mechanical blind hole ≥0.15mm Laser blind hole ≥0.075mm |
Could be specified, needs to be review |
| 6 | Hole Size | Min unilateral ≥3mil | |
| 7 | Hole Copper |
No laser blind burial: mechanical hole copper >18um Laser blind burial: mechanical hole copper ≥13um |
Could be specified, needs to be review |
| 8 | Via Electroplating |
Laser Via Electroplating depth: 0.05mm-0.1mm Laser Via Electroplating depth tolerance: ±15% |
Could be specified, needs to be review Via Electroplating process: Copper is filled into the hole by electroplating technology to ensure that the surface of the hole is fully metalized |
Carbon oil
| Number | Item | Standard | Remarks |
| 1 | Thickness | 0.4 2 mil + / - 0.4 mil | Divided by 1mil, when the thickness of ≥1mil is required, secondary printing is required |
| 2 | Carbon oil surface width | Usually more than 16mil, min 14mil | Less than standard needs to be assessed |
| 3 | Carbon oil bridge width | Usually more than 16mil, min 12mil | Less than standard needs to be assessed |
| 4 | Carbon oil resistance | Usually≤50Ω | Below 200Ω could be customized |
Counterbore
| Number | Item | Standard | Remarks |
| 1 | T-shaped counterbore |
Depth ≥0.2mm; Hole size ≥2mm; PTH hole tolerance +/-0.2mm; NPTH hole tolerance +/-0.15mm; |
If out of range can be customized; deep borehole |
| 2 | V-shaped counterbore |
Normal Angle 90°; Hole size 4-20mm; PTH hole tolerance +/-0.2mm; NPTH hole tolerance +/-0.15mm; |
If out of range can be customized; horn hole |
Epoxy filled vias
| Number | Item | Standard | Remarks |
| 1 | Ink | Zhuyou epoxy ink | Zhuyou epoxy ink |
| 2 | Size | Board length ≤650mm | Oversize needs to be evaluated |
| 3 | Board thickness | 0.2-8.0mm | |
| 4 | Plugged via hole size | 0.2-1.0mm | Overspecification needs to be evaluated |
| 5 | Hole range | Adjacent hole size difference within 0.2mm | The difference cannot exceed this value, otherwise we need to default to allow our company to reduce the hole to reach the range value |
| 6 | Hole sunken |
Hole size ≤0.4mm, sunken ≤5μm Hole size ≤0.4mm, sunken ≤15μm |
Hole size ≤0.4mm, sunken ≤15μm Hole size > 0.4mm, sunken ≤50μm Controlling zero sag requires technical reevaluation. |
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