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Common Process Capability

Number Type Content Process Capability Remarks
1 Process capability Layer 1-14 layers

Refers to the number of electrical layers in PCB

(number of copper layers). At present, PCBbuy only

accepts 1-14 layers of through-hole board

(blind buried hole board)

2 Lamination Stackup 4/6/8/10/12/14 layers Check for stackup
3 Type of material Material FR-4 KB-6160(TG135)
KB-6165F(TG150)
KB-6167F(TG170)
FR-4(Halogen-free) KB HF-140
CEM-1 KB-5150(TG130)
FR-4(black core) GF113 BK A class
ROHS text report of black core
REACH text report of black core
4 Type of material Ink Guangxin Halogen-free soldering ink
solder soldering ink
Taiyo Flush coating of text
5 Process capability Panel size(Max) 1000×600mm

1-2: 1 piece and panel 1000*600mm (VCUT direction shall not exceed 600mm)

4 layers: 1 piece 1000*500mm, assembling plate 1000*480mm (VCUT direction shall not exceed 480mm)

6 layers: 1 piece 900*500mm, panel 900*480mm (VCUT direction shall not exceed 480mm)

8 layers: 1 piece 625*500mm, panel 625*480mm (VCUT direction shall not exceed 480mm)

10 layers / 12 layers: 1 piece 400*300mm, assembling 600*480mm (VCUT direction shall not exceed 480mm)

6 Process capability Panel size(Min) 1×3mm

The minimum board size of 1 piece > 1×3mm, ≤20×20mm is super small board The minimum board size of the panel is > 60×60mm The minimum board size of V slot board is > 80×80mm Note: OSP≥50*80mm HASL ≥80*120MM

7 Process capability Board Thickness(Max) 3.0mm Board Thickness:0.25/0.3/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm
8 Process capability Board Thickness(Min) 0.25mm
9 Process capability Thin Core Thickness(Min) 0.20mm The thickness of copper(custom min copper thickness is 0.10mm)
10 Process capability Finished Board Thickness Tolerance (0.3mm ≤ Board Thickness < 0.8mm) ±10%

If the thickness of board is T=1.6mm. the thickness of finished Board is 1.44mm(T-1.6×10%)~1.76mm(T+1.6×10%)

11 Process capability Finished Board Thickness Tolerance (0.4mm≤Board Thickness<0.8mm) ±0.10mm

If the thickness of board is T=0.6mm. the thickness of finished Board is 0.5mm(T-0.1)~0.7mm(T+0.1)

12 Process capability Warpage(Min) 0.75% Diagonal length *0.75% (custom≤0.5%)
13 Drilling Drill Size(Max) Φ6.5mm More than 6.5mm Can Reaming
14 Drilling Drill Size(Min) Φ0.20mm 0.20mm is the minimum hole size of drilling(custom 0.15mm)
15 Drilling Copper half hole soze (min) Φ0.60mm If the value is smaller than this value, evaluate the value based on actual data
16 Drilling HDT hole size (min) Φ0.10mm If the value is smaller than this value, evaluate the value based on actual data
17 Base Copper Thickness of Outer Layer(Min)

Single sided and double sided: Hoz/Multilayer 1/3oz

The minimum thickness of copper foil for outer circuit, The minimum of PCBbuy can do Single sided and double sided Hoz/ Multilayer 1/3oz

18 Process capability Base Copper Thickness of Outer Layer(Max) 4oz The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤10oz)
19 Process capability Base Copper Thickness of inner Layer(Min) 1/3oz The minimum thickness of copper foil for inter circuit, The minimum of PCBbuy can do 1/3oz
20 Process capability Base Copper Thickness of inner Layer(Max) 3oz The maximum thickness of copper foil for outer circuit (the material copper thickness could custom ≤ 4oz)
21 Thickness of insulation layer (min) 0.07mm The thickness of PP after lamination is 0.07mm
22 Surface finish Aspect Ratio(Max) 10:1 Could be customized≤20:1
23 Drilling Hole Diameter Tolerance(PTH) ±0.075mm (Assignable ±0.05mm) PTH: Tolerance of drilling is ±0.075mm, for example the design of hole is 0.6mm the aperture of finished board varies from 0.525mm-0.675mm is acceptable (VIA attributes of the hole is CLP hole, no tolerance control)
24 Drilling Hole Diameter Tolerance(NPTH) ±0.05mm NPTH via: Tolerance of drilling is ±0.05mm, for example the design of hole is 0.6mm the hole size of finished board varies from 0.55mm-0.65mm is acceptable
25 Drilling Hole Position Tolerance(Compared with CAD Data) ±0.05mm
26 Process capability Holewall Copper Thickness(Full Hole) Conventional average ≥20um Our company routinely upgrades to the average hole copper ≥20um to improve PCB conduction stability and anti-aging ability, but the customer can specify otherwise
27 Trace width/space Trace Width/Spacing of Outer Layer(Min)

T/Toz: 2.5mil/2.5mil(T=1/3oz)

H/Hoz: 2.5mil/2.5mil

1/1oz: 3mil/3mil

2/2oz: 6mil/6mil

3/3oz: 10mil/10mil

4/4oz:14 mil/14mil

Parameter is Default of PCBBUY
28 Trace width/space Trace Width/Spacing of Inner Layer(Min)

T/T oz: 2.5mil/ 2.5mil(T=1/3oz)

H/H oz: 2.5mil/2.5mil

1/1 oz: 4mil/4mil

2/2 oz: 5mil/5mil

3/3 oz: 8mil/8mil

4/4OZ: 14 mil/14 mil

Parameter is Default of PCBBUY
29 Trace width/space Etching Tolerance ±20%(assign 10%) 3.2mil(T-4mil×20%)~4.8mil(T+4mil×20%) If the line width is T=4mil, then the real line width is 3.2mil(T-4mil×20%)~4.8mil(T+4mil×20%)
30 Pattern transfer Outer Image to Hole Tolerance(Min) ±3mil Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified
31 Pattern transfer Hole to Hole Tolerance(Min) ±2mil Circuit Image to Hole Tolerance(Min) Physical difference of ±2mil is qualified
32 Solder mask Solder Mask Registration Tolerance ±3mil Circuit Image to Hole Tolerance(Min) Physical difference of ±3mil is qualified
33 Solder mask Solder Mask Thickness(Min) ≥8μm Solder mask with Guangxin Ink ≥8μm
34 Solder mask Solder bridge(minimum)

Green oil:4mil

Black/white、pink:5mil

Other variegated oils:4mil

If there are welding resistance bridge requirements, please note! If the color of the resistance is green, the width of the ink must be ≥4mil(wire bonding pad with The cooper thickness of 1oz, The spacing needs to be 7mil)black/white/pink: the width of the ink must be ≥5mil (wire bonding pad with Thecooper thickness of 1oz, The spacing needs to be 7mil) other variegated oils: the width of the ink must be ≥4mil
35 Solder mask Solder Mask Plugged Hole Diameter ≤0.45mm Solder Mask Plugged Hole size ≤0.45mm when the hole in board ≥0.45mm Default oil plugging will not be full
36 Minimum Nickel Thickness of ENIG Minimum Gold Thickness of ENIG(Max) 100-200uin(μ") Special requirements can be specified
37 Surface plating thickness Nickel palladium NI:200u"
Pd:1-10u"
Au:1-10u"
Special requirements can be specified, The specified thickness of palladium and gold of ENEPIG shall not exceed 30U ", and the specified thickness of nickel shall not exceed 300U"
38 Surface plating thickness Minimum Gold Thickness of ENIG(Max) 1-3uin(μ") Special requirements can be specified
39 Surface plating thickness Solder Thickness on XFP (HAL) 2-40μm
40 Surface plating thickness Electric ENEPIG plating NI:120-200u"
AU 1-100 u"
The composition is alloy (palladium, nickel, cobalt, chromium, bismuth, etc.), such as whole plate electric gold plating, non-standard order, gold thickness can be specified separately
41 Surface plating thickness Selective electroplating + goldfingers AU:3-100 u" Selective leads - you need to select residue or non-residue when placing an order
42 Appearance Routing Dimension Tolerance ±5.2mil (0.13MM) Limit of plus or minus 2 mil (0.05 MM) Designated laser cutting
43 Appearance Routing Dimension Tolerance(Hole to Edge) ±7mil (0.177MM) ±6mil (0.15MM) ±6mil (0.15MM)
44 Appearance Radius by Routing (Internal Angle)(Min) R≥0.5mm
45 Appearance Countersink Hole Size Due to the requirements of customers
46 Appearance V-V-CUT Remaining Thickness Tolerance(MIN) ±0.10mm The minimum of V-CUT Remaining Thickness ±0.10mm
47 Appearance V-CUT MISREGISTRATION (MIN) 0.10mm The minimum of V-CUT MISREGISTRATION 0.10mm
48 Appearance V-CUT boards thickness(min/max) 0.5mm/3.2mm Currently support V-CUT thickness 0.5mm to 3.2mm (2.4≤ board thickness ≤0.4mm recommended stamp hole, if specified V-CUT does not meet the tolerance of ±0.10mm by default)
49 Process capability Impedance Tolerance(Min) ±10% If Impedance is T=50Ω then the real Impedance 45Ω(T-50Ω×10%)~55Ω(T+50Ω×10%)
50 Process capability Pitch-row / the processing range from hole to trace ±10%

0.2mm,PCB via alignment

0.3mm , components alignment

51 Process capability High-end option process

V-cut length is not limited

Four-wire measurement

two - color welding resistance,

two - color text

V-cut nearest two tools distance ≥2mm

The minimum pad of measurement ≥4*8mil

(High-end surcharge is in effect)

Two color soldering resistance seamless butt tolerance+/-1mm

52 Process capability Hole spacing/hole-to-trace range

V-cut length is not limited

Four-wire measurement

two - color welding resistance,

two - color text

VIA through hole to hole 0.25mm

PTH component hole spacing 0.5mm

VIA through hole to trace 0.2mm

PTH component hole to trace 0.3mm

Plugged Via Production Capacity of Panel

Number Item Standard Remarks
1 Production size 210-610*760mm Overspecification requires technical reassessment
2 Board thickness 0.2-8.0mm Overspecification requires technical reassessment
3 Hole size of plugged via Drilling 0.15-0.8mm Max hole size of plugged via Overspecification requires technical reassessment
4 Ink Zhuyou epoxy ink

ROHS text report of epoxy ink

UL text report of epoxy ink

Technical data of epoxy ink

5 Surface copper thickness Supplied surface copper ≥15μmPlating filling hole and grinding surface copper≥30μm Substrates below 15μm are extremely risky
6 Aspect ratio(board thickness to hole size) Through hole 40:1 blind via 1:1 Overspecification requires technical reassessment
7 Leave a margin of board Distance of board edge and Fortress hole ≥15mm Either side of board≥15mm is ok
8 Hole size The size range of adjacent holes is within 0.3mm Overspecification requires technical reassessment
9 Reduce copper amount when the board is flat reduce the amount of copper 3-5μm If over 8μm, copper should be reduced separately

Optional Plugged Via Production Capacity

Number Item Standard Remarks
1 Production size 210-610*760mm Overspecification requires technical reassessment
2 Board thickness 0.2-8.0mm Overspecification requires technical reassessment
3 Hole size of plugged via ≥0.15mm Overspecification requires technical reassessment
4 Ink Zhuyou epoxy ink

ROHS text report of epoxy ink

UL text report of epoxy ink

Technical data of epoxy ink

5 Surface copper thickness Supplied surface copper ≥15μm Ubstrates below 15μm are extremely
6 Aspect ratio(board thickness to hole size) Through hole 30:1 blind via 1:1 Overspecification requires technical reassessment
7 Leave a margin of board Space of fortress hole and non fortress hole>0.4mm Overspecification requires technical reassessment
8 Hole size Single PNL hole size range within 0.3mm Overspecification requires technical reassessment
9 Reduce copper amount when the board is flat reduce the amount of copper 3-5μm If over 8μm, copper should be reduced separately

Processing Quality (If the customer does not specify any special requirements, our company will produce according to the following control indicators)

Number Item Standard Remarks
1 Sunken hole

hole size ≤0.4mm, dent ≤15μm

hole size > 0.4mm, dent ≤50μm

Control of zero dent requires technical re-evaluation

If over 8μm, copper should be reduced separately
2 Over plugged/ missing plugged None None
3 Incomplete grinding Remain epoxy of hole edge≤20μm Remain epoxy of hole edge≤50μm
4 Surface copper after grinding RZ≤0.5μm Rt≤1.0μm Ubstrates below 15μm are extremely
5 Expand and contract after grinding

board thickness≥0.4mm expansion and

contraction≤0.03%

board thickness<0.4mm decide through

consultation Board thickness≥0.4mm Expand and

contract≤0.03% come to an agreement

board thickness≥0.4mm expansion and

contraction≤0.03%

board thickness<0.4mm decide through consultation

Note:

1. Grinding requirements: it is necessary to ensure that the board is pressed flat as the premise and the surface cannot be uneven.

2.Special material (ceramic board, PTFE material will not be processed) should be specially marked on the delivery note. If the special material is not marked, it will be produced as normal (FR4).

3.The default TG value of resin in our company is 150, which matches the TG value of processed copper-clad plate 150±5. If any processed plate exceeds the range, please inform us separately.

Our company will not assume any responsibility for the subsequent process scrap caused by this problem.

4.Before the customer sends the plug via, it must go through the pre-treatment. The surface of the board and the hole cannot remain the liquid medicine or plug the vias, otherwise it will cause

the bad plug hole.

5.If the customer's incoming material exceeds our production capacity and insists on continuing production after communication, our company will not assume any responsibility for the scrap generated.