The reasons for gold plating on circuit boards can be attributed to several key factors:

Enhanced corrosion resistance and electrical performance: Gold plating effectively shields the copper layer, preventing oxidation and corrosion, thereby maintaining circuit stability and reliability. Additionally, gold plating offers excellent conductivity, elevating the electrical performance of the circuit.

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Improved connectivity: Gold plating enhances the connectivity of circuit boards, ensuring more reliable and stable connections. In electronic devices, connectivity is crucial as it necessitates the transmission of electrical signals while maintaining a stable operational state.

Cost reduction: In smaller-sized circuit boards, gold plating can reduce production costs. Compared to traditional chemical nickel-gold processes, gold plating requires thinner layers and shorter processing times, thus lowering production expenses.

Enhanced signal transmission quality: In high-speed circuits, signal transmission quality is paramount. Gold plating helps reduce signal loss and distortion, thereby enhancing the overall quality of signal transmission.

In summary, gold plating on circuit boards aims to improve corrosion resistance, electrical performance, connectivity, cost-effectiveness, and signal transmission quality. These advantages make gold plating an indispensable component of modern electronic devices.