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BGA 4 Layer PCB Manufacturing with Precision, Quality, and Advanced Capabilities

By:PCBBUY 08/14/2025 15:09

BGA 4 Layer PCB Manufacturing with Precision, Quality, and Advanced Capabilities

Introduction to BGA 4 Layer PCB


Ball Grid Array (BGA) is a high-density surface mount packaging technology widely used in modern electronics, enabling superior electrical performance and space efficiency. In many designs, the BGA 4 layer PCB configuration is preferred because it balances complexity, performance, and cost-effectiveness.


At PCBBUY, we specialize in manufacturing high-quality BGA 4 layer PCBs with precise control over pad size, via technology, and layer stack-up. Our advanced facilities can achieve BGA pads as small as 0.25 mm, making us an ideal partner for high-density, fine-pitch applications.


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Key Features of BGA 4 Layer PCB


A standard BGA 4 layer PCB from PCBBUY typically features:


  • Layer Stack-up: Optimized for signal integrity and power delivery, often in the      configuration:

    1. Top Signal Layer

    2. Ground Plane

    3. Power Plane

    4. Bottom Signal Layer

  • Smallest BGA Pad Size: 0.25 mm minimum pad diameter, enabling ultra-fine pitch      assembly.

  • High Routing Density: Capability to handle 0.1 mm line/space for fine-pitch BGA      devices.

  • Material Options: FR4 high-Tg, low Dk/Df laminates for high-speed signal performance.

  • Surface Finishes: ENIG, ENEPIG, OSP — all suitable for high-reliability BGA      soldering.

 

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BGA Soldering Challenges and PCB Design Considerations


Designing for BGA 4 layer PCBs requires precise attention to detail:


  • Fine Pitch Accommodation: For devices with pitch as low as 0.4 mm, via-in-pad and microvia technology are often necessary.

  • Via Technology: Blind and buried vias enable breakout routing without sacrificing      signal quality.

  • Solder Mask Definition: PCBBUY applies SMD-defined pads to prevent solder bridging      and ensure proper ball wetting.

  • Thermal Management: Balanced copper design and controlled via filling improve heat      dissipation.


By integrating via-in-pad plating and precise solder mask alignment, PCBBUY ensures excellent solder joint reliability, even for the most demanding BGA designs.

 

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Manufacturing Process for BGA 4 Layer PCB at PCBBUY


We follow a rigorous manufacturing process to ensure high yield and performance:


  1. Layer Stack-up & Lamination — Multi-stage lamination with tight layer-to-layer registration control.

  2. High-Precision Drilling — Laser drilling for microvias, mechanical drilling for through-holes with ±0.05 mm tolerance.

  3. Copper Plating & Via Filling — Ensures flat pad surfaces for BGA soldering and consistent copper thickness.

  4. Solder Mask Application — High-resolution imaging to guarantee mask alignment within ±0.025 mm.

  5. Surface Finish — Applying ENIG or ENEPIG for superior solderability and oxidation      resistance.

  6. Electrical Testing — 100% E-test to verify connectivity and impedance accuracy.

 

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Quality Control and Testing for BGA 4 Layer PCB


  • X-ray Inspection: Detects internal solder joint alignment and voids.

  • TDR (Time Domain Reflectometry) Testing: Ensures impedance compliance within ±10% tolerance.

  • Automated Optical Inspection (AOI): Detects trace width variations and solder mask defects.


Every BGA 4 layer PCB from PCBBUY undergoes full functional and dimensional inspection to guarantee performance.

 

Applications of BGA 4 Layer PCB


Our BGA 4 layer PCB solutions are widely used in:


  • Smartphones and tablets

  • Networking and telecommunication devices

  • Industrial control systems

  • Medical diagnostic and imaging equipment

  • High-performance computing modules

 

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Why Choose PCBBUY for Your BGA 4 Layer PCB Projects


  • 0.25 mm smallest pad capability for ultra-fine pitch BGAs

  • 0.1 mm minimum trace/space for high-density designs

  • ISO, UL, and RoHS certified production processes

  • Fast prototype turnaround — as quick as 24 hours for urgent projects

  • Experienced engineering support for design optimization and cost reduction

 

Conclusion


The BGA 4 layer PCB is a critical foundation for modern, high-performance electronics. At PCBBUY, we combine cutting-edge manufacturing technology, stringent quality control, and skilled engineering expertise to deliver PCBs that meet the highest standards in precision and reliability.


Whether your design involves high-speed signals, ultra-fine pitch BGAs, or complex stack-ups, PCBBUY has the capability to turn your concept into reality — on time and within specification.

Contact PCBBUY today to get your custom BGA 4 layer PCB quote.

 


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