BGA 4 Layer PCB Manufacturing with Precision, Quality, and Advanced Capabilities
By:PCBBUY 08/14/2025 15:09

Introduction to BGA 4 Layer PCB
Ball Grid Array (BGA) is a high-density surface mount packaging technology widely used in modern electronics, enabling superior electrical performance and space efficiency. In many designs, the BGA 4 layer PCB configuration is preferred because it balances complexity, performance, and cost-effectiveness.
At PCBBUY, we specialize in manufacturing high-quality BGA 4 layer PCBs with precise control over pad size, via technology, and layer stack-up. Our advanced facilities can achieve BGA pads as small as 0.25 mm, making us an ideal partner for high-density, fine-pitch applications.
Key Features of BGA 4 Layer PCB
A standard BGA 4 layer PCB from PCBBUY typically features:
-
Layer Stack-up: Optimized for signal integrity and power delivery, often in the configuration:
-
Top Signal Layer
-
Ground Plane
-
Power Plane
-
Bottom Signal Layer
-
Smallest BGA Pad Size: 0.25 mm minimum pad diameter, enabling ultra-fine pitch assembly.
-
High Routing Density: Capability to handle 0.1 mm line/space for fine-pitch BGA devices.
-
Material Options: FR4 high-Tg, low Dk/Df laminates for high-speed signal performance.
-
Surface Finishes: ENIG, ENEPIG, OSP — all suitable for high-reliability BGA soldering.
BGA Soldering Challenges and PCB Design Considerations
Designing for BGA 4 layer PCBs requires precise attention to detail:
-
Fine Pitch Accommodation: For devices with pitch as low as 0.4 mm, via-in-pad and microvia technology are often necessary.
-
Via Technology: Blind and buried vias enable breakout routing without sacrificing signal quality.
-
Solder Mask Definition: PCBBUY applies SMD-defined pads to prevent solder bridging and ensure proper ball wetting.
-
Thermal Management: Balanced copper design and controlled via filling improve heat dissipation.
By integrating via-in-pad plating and precise solder mask alignment, PCBBUY ensures excellent solder joint reliability, even for the most demanding BGA designs.
Manufacturing Process for BGA 4 Layer PCB at PCBBUY
We follow a rigorous manufacturing process to ensure high yield and performance:
-
Layer Stack-up & Lamination — Multi-stage lamination with tight layer-to-layer registration control.
-
High-Precision Drilling — Laser drilling for microvias, mechanical drilling for through-holes with ±0.05 mm tolerance.
-
Copper Plating & Via Filling — Ensures flat pad surfaces for BGA soldering and consistent copper thickness.
-
Solder Mask Application — High-resolution imaging to guarantee mask alignment within ±0.025 mm.
-
Surface Finish — Applying ENIG or ENEPIG for superior solderability and oxidation resistance.
-
Electrical Testing — 100% E-test to verify connectivity and impedance accuracy.
Quality Control and Testing for BGA 4 Layer PCB
-
X-ray Inspection: Detects internal solder joint alignment and voids.
-
TDR (Time Domain Reflectometry) Testing: Ensures impedance compliance within ±10% tolerance.
-
Automated Optical Inspection (AOI): Detects trace width variations and solder mask defects.
Every BGA 4 layer PCB from PCBBUY undergoes full functional and dimensional inspection to guarantee performance.
Applications of BGA 4 Layer PCB
Our BGA 4 layer PCB solutions are widely used in:
-
Smartphones and tablets
-
Networking and telecommunication devices
-
Industrial control systems
-
Medical diagnostic and imaging equipment
-
High-performance computing modules
Why Choose PCBBUY for Your BGA 4 Layer PCB Projects
-
0.25 mm smallest pad capability for ultra-fine pitch BGAs
-
0.1 mm minimum trace/space for high-density designs
-
ISO, UL, and RoHS certified production processes
-
Fast prototype turnaround — as quick as 24 hours for urgent projects
-
Experienced engineering support for design optimization and cost reduction
Conclusion
The BGA 4 layer PCB is a critical foundation for modern, high-performance electronics. At PCBBUY, we combine cutting-edge manufacturing technology, stringent quality control, and skilled engineering expertise to deliver PCBs that meet the highest standards in precision and reliability.
Whether your design involves high-speed signals, ultra-fine pitch BGAs, or complex stack-ups, PCBBUY has the capability to turn your concept into reality — on time and within specification.
Contact PCBBUY today to get your custom BGA 4 layer PCB quote.
Industry Category