What is Prepreg in PCB & Why is Important for PCB Manufacturing?
Prepreg is a dielectric material that designers pack in between a copper and a Core or between two Cores in a PCB to provide the required insulation. Prepreg is simply an insulation layer. Since it can bind a copper foil and a Core, it is safe to refer to it as a binding material. Users can also modify Prepreg to their needs as peculiar dielectric materials. They can also use a chemical process to transform a certain part of a Prepreg into a conductive region through the combination of specific catalysts and additives. Prepreg is a part of untreated FR4. The FR4 is utilized in the PCB manufacturing process, where it performs the function of binding the etched cores together. It can also be useful in gluing the copper foil with the etched core. Thus, the Prepreg in a PCB can vary in thickness in accordance with the height of the etched boards. If we compare Prepreg vs. core, the latter is FR4 coated with copper either side and is made in a core factory. But the Prepreg is sort of virgin FR4 that gels itself into the structure of a PCB board.Wanna know PCB knowledge? Check and read for more. What is the Prepreg PCB preparation process? A typical Prepreg process involves: · Reinforcing with resins which can be either thermoplastic or thermoset.· Removal of excess resin· Preparation of curing with high and low-temperature settings What are the applications of Prepreg in PCB? Multi-Layered BoardsThe prepreg in a multi-layered board is what holds the layers together. Once you stack all the layers of the board, you fuse them together by exposing the board to high temperatures. The thickness of the prepreg will be in accordance with the thickness of the overall board. The prepreg should have specific characteristics to it when used on a multi-layered board. The cloth surface should look and feel smooth and be free of any oil, stains, defects, foreign matter, cracks, or excessive resin powder. Complex PCBsIf you have a complex PCB, you’ll likely have a more complex prepreg. You’ll need to use different types of the prepreg to achieve the required thickness of both the prepreg and the board itself. What are the differences of Prepreg and core? PCB cores and laminates are similar and quite different. Your core is effectively one or more Prepreg laminates that are pressed, hardened, and cured with heat, and the core is plated with copper foil on each side. The Prepreg material is impregnated with a resin, where the resin is hardened but left uncured. Most manufacturers describe the prepreg as the glue that holds core materials together; when two cores are stacked on each side of a prepreg laminate, exposing the stack to heat causes the resin to begin bonding to the adjacent layers. The hardened resin slowly cures through cross linking, and its resulting material properties start to approach those of the core layers. The resin material encases a glass weave, and the manufacturing process for this glass weave is very similar to that used to manufacture yarns. The glass weave can be quite tight (e.g., 7628 prepreg) or loose (e.g., 1080 prepreg), which is controlled with a loom during manufacturing. Any gaps and the overall homogeneity of the yarn will determine the electromagnetic properties, which is then responsible for dispersion, losses, and any fiber weave effects seen by signals in the board. PCB core vs. prepreg materials can have somewhat different dielectric constants, depending on the resin content, type of resin, and glass weave. This can be a problem when designing boards that require very precise impedance matching as the effective dielectric constant seen by a signal on a track depends on the dielectric constants of the surrounding materials. Not all prepreg and core materials are compatible with each other, and core/prepreg stacks with very different dielectric constants make it difficult to predict exact dielectric constants and losses in an interconnect . With any PCB core or prepreg material, creepage and leakage current is a concern at high voltage. Electromigration of copper and subsequent growth of conductive filaments are one reason for creepage specifications for FR4 materials. This problem, as well as a desire to increase glass transition and decomposition temperatures, motivated a switch to non-dicyandiamide (non-DICY) resins in FR4 cores and laminates. Phenolic resins provide higher decomposition and glass transition temperatures compared to DICY resins while also providing higher insulation resistance after full curing. How to Choose Prepreg in PCB Design & Fabrication? The Prepregs 106, 1080, 2116, 2313, 7628 of different material suppliers vary in thickness and resin content. In addition, there are versions of standard resin, medium resin and high resin, depending on the resin content. The best possible material is used depending on the desired final PCB thickness, stack-up, dielectric constant (impedance), dimensional stability (registration) and cost. The thicker the prepreg, the higher cost will be. i.e. 7628 is higher than 2116. The cost of 2 sheets 1080 is higher than that of 1 sheet 2116. What’s more, similar to copper clad laminates (CCLs), Prepregs are also available in High-Tg and halogen-free types, but not always in every possible thickness. If you have custom layer buildup, please always state the desired final PCB thickness, but not just the prepreg names.Wanna know PCB knowledge? Check and read for more.
PCB Knowledge ⋅ 02/21/2022 09:45